HERMETICITY: The state of being airtight or gastight.
The Composite Modules Division of CMI has over 40 years of technology and experience to develop hermetic packaging for electronic devices and assemblies. By focusing on the CTE (Coefficient of Thermal Expansion) Mismatch with the enclosure and respective connectors, our patented materials and manufacturing processes will create a package for the electronics that achieves Mil-STD 883/Method 1014 requirements.